Design and demonstration of ultra-Thin 3D glass-based 5G modules with low-loss interconnects Conference

Watanabe, AO, Lin, TH, Ogawa, T et al. (2018). Design and demonstration of ultra-Thin 3D glass-based 5G modules with low-loss interconnects . 180-183. 10.23919/ICEP.2018.8374698

cited authors

  • Watanabe, AO; Lin, TH; Ogawa, T; Markondeya Raj, P; Sundaram, V; Tentzeris, MM; Tummala, RR

abstract

  • This paper demonstrates six-metal-layer antenna-To-receiver signal transitions on panel-scale processed ultra-Thin glass-based 5G module substrates with 50-Ω transmission lines and micro-via transitions in re-distribution layers. The glass modules consist of low-loss dielectric thin-films laminated on 100-μm glass cores. Modeling, design, fabrication, and characterization of the multilayered signal interconnects were performed at 28-GHz band. The surface planarity and dimensional stability of glass substrates enabled the fabrication of highly-controlled signal traces with tolerances of 2% inside the re-distribution layers on low-loss dielectric build-up thin-films. The fabricated transmission lines showed 0.435 dB loss with 4.19 mm length, while microvias in low-loss dielectric thin-films showed 0.034 dB/microvia. The superiority of glass substrates enable low-loss link budget with high precision from chip to antenna for 5G communications.

publication date

  • June 6, 2018

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 180

end page

  • 183