Design and Demonstration of Ultra-thin 3D Glass-based 5G Modules with Low-loss Interconnects Conference

Watanabe, Atom O, Lin, Tong-Hong, Ogawa, Tomonori et al. (2018). Design and Demonstration of Ultra-thin 3D Glass-based 5G Modules with Low-loss Interconnects . 180-183.

Industry Collaboration International Collaboration

cited authors

  • Watanabe, Atom O; Lin, Tong-Hong; Ogawa, Tomonori; Raj, P Markondeya; Sundaram, Venkatesh; Tentzeris, Manos M; Tummala, Rao R

authors

date/time interval

  • April 17, 2018 -

publication date

  • January 1, 2018

keywords

  • 5G
  • ANTENNA-IN-PACKAGE
  • Engineering
  • Engineering, Electrical & Electronic
  • Glass substrates
  • Low loss interconnects
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology
  • redistribution layer

Location

  • JAPAN, Kuwana

Conference

  • International Conference on Electronics Packaging (ICEP) / iMAPS All Asia Conference (IAAC)

publisher

  • IEEE

start page

  • 180

end page

  • 183