High Throughput and Fine Pitch Cu-Cu Interconnection Technology for Multichip Chip-Last Embedding Conference

Choudhury, Abhishek, Kumbhat, Nitesh, Khan, Sadia A et al. (2011). High Throughput and Fine Pitch Cu-Cu Interconnection Technology for Multichip Chip-Last Embedding . 2021-2027.

Industry Collaboration International Collaboration

cited authors

  • Choudhury, Abhishek; Kumbhat, Nitesh; Khan, Sadia A; Raj, P Markondeya; Sundaram, Venky; Meyer-Berg, Georg; Tummala, Rao

authors

date/time interval

  • May 31, 2011 -

publication date

  • January 1, 2011

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 61st Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 2021

end page

  • 2027