First Demonstration of Drop-test Reliability of Ultra-thin Glass BGA Packages Directly Assembled on Boards for Smartphone Applications Conference

Singh, Bhupender, Smet, Vanessa, Lee, Jaesik et al. (2015). First Demonstration of Drop-test Reliability of Ultra-thin Glass BGA Packages Directly Assembled on Boards for Smartphone Applications . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1566-1573.

Industry Collaboration International Collaboration

cited authors

  • Singh, Bhupender; Smet, Vanessa; Lee, Jaesik; Menezes, Gary; Kobayashi, Makoto; Raj, Pulugurtha Markondeya; Sundaram, Venky; Roggeman, Brian; Ray, Urmi; Radojcic, Riko; Tummala, Rao

authors

date/time interval

  • May 26, 2015 -

publication date

  • January 1, 2015

published in

keywords

  • Computer Science
  • Computer Science, Theory & Methods
  • Engineering
  • Engineering, Electrical & Electronic
  • IMPACT RELIABILITY
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Conference

  • IEEE 65th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1566

end page

  • 1573