Demonstration of Next-generation Au-Pd Surface Finish with Solder-capped Cu Pillars for Ultra-fine Pitch Applications Conference

Huang, Ting-Chia, Smet, Vanessa, Raj, Pulugurtha Markondeya et al. (2016). Demonstration of Next-generation Au-Pd Surface Finish with Solder-capped Cu Pillars for Ultra-fine Pitch Applications . 2553-2560. 10.1109/ECTC.2016.331

Industry Collaboration International Collaboration

cited authors

  • Huang, Ting-Chia; Smet, Vanessa; Raj, Pulugurtha Markondeya; Tummala, Rao R; Ramos, Gustavo; Kilian, Arnd; Taylor, Robin; Nichols, Rick

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

keywords

  • AG
  • BEHAVIOR
  • EMBRITTLEMENT
  • Engineering
  • Engineering, Electrical & Electronic
  • GOLD
  • INTERFACIAL REACTION
  • JOINTS
  • SHEAR-STRENGTH
  • Science & Technology
  • Technology
  • interfacial reaction
  • solder interconnections
  • surface finishes

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 2553

end page

  • 2560