Advanced Low-K Polymer Dielectric Materials and Interfaces for Fine-Pitch Re-Distribution-Layer (RDL) to Enable 2.5D and Fan-out Packages Article

Dwarakanath, Shreya, Raj, Pulugurtha Markondeya, Losego, Mark D et al. (2019). Advanced Low-K Polymer Dielectric Materials and Interfaces for Fine-Pitch Re-Distribution-Layer (RDL) to Enable 2.5D and Fan-out Packages . MA2019-02(28), 1265-1265. 10.1149/ma2019-02/28/1265

cited authors

  • Dwarakanath, Shreya; Raj, Pulugurtha Markondeya; Losego, Mark D; Tummala, Rao R

authors

publication date

  • September 1, 2019

keywords

  • 40 Engineering
  • 4016 Materials Engineering
  • 7 Affordable and Clean Energy

Digital Object Identifier (DOI)

publisher

  • The Electrochemical Society

start page

  • 1265

end page

  • 1265

volume

  • MA2019-02

issue

  • 28