Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers Conference

Sethi, Kanika, Sharma, Himani, Raj, P Markondeya et al. (2011). Conformal Atomic Layer Deposition (ALD) of Alumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High Capacitance Density on Silicon Interposers . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1928-1932.

cited authors

  • Sethi, Kanika; Sharma, Himani; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 31, 2011 -

publication date

  • January 1, 2011

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 61st Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1928

end page

  • 1932