Conformal Atomic Layer Deposition (ALD) of alumina on high surface-area porous copper electrodes to achieve ultra-high capacitance density on silicon interposers
Conference
Sethi, K, Sharma, H, Raj, PM et al. (2011). Conformal Atomic Layer Deposition (ALD) of alumina on high surface-area porous copper electrodes to achieve ultra-high capacitance density on silicon interposers
. 1928-1932. 10.1109/ECTC.2011.5898780
Sethi, K, Sharma, H, Raj, PM et al. (2011). Conformal Atomic Layer Deposition (ALD) of alumina on high surface-area porous copper electrodes to achieve ultra-high capacitance density on silicon interposers
. 1928-1932. 10.1109/ECTC.2011.5898780