3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications Conference

Watanabe, Atom O, Lin, Tong-Hong, Ali, Muhammad et al. (2019). 3D Glass-Based Panel-Level Package with Antenna and Low-Loss Interconnects for Millimeter-Wave 5G Applications . 10.1109/imc-5g47857.2019.9160350

Industry Collaboration International Collaboration

cited authors

  • Watanabe, Atom O; Lin, Tong-Hong; Ali, Muhammad; Ogawa, Tomonori; Raj, P Markondeya; Tentzeris, Manos M; Tummala, Rao R; Swaminathan, Madhavan

authors

date/time interval

  • August 15, 2019 -

publication date

  • January 1, 2019

keywords

  • 5G communication
  • Antenna in package
  • Computer Science
  • Computer Science, Information Systems
  • Engineering
  • Engineering, Electrical & Electronic
  • Glass substrate
  • Science & Technology
  • Technology
  • Telecommunications
  • Through-package via
  • Yagi-Uda antenna

Location

  • GA, Atlanta

Digital Object Identifier (DOI)

Conference

  • IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G)

publisher

  • IEEE