Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface Resistance Conference

Nedumthakady, Nithin, Deprospo, Bartlet, Raj, P Markondeya et al. (2018). Integrated Copper Heat Spreaders in Glass Panel Embedded Packages with Near-Zero Thermal Interface Resistance . 2013-2018. 10.1109/ECTC.2018.00302

cited authors

  • Nedumthakady, Nithin; Deprospo, Bartlet; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao; Byers, Kyle; Garrison, Sean; Gibson, Chris; Elsbury, Michael

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 2013

end page

  • 2018