Integrated copper heat spreaders in glass panel embedded packages with near-zero thermal interface resistance Conference

Nedumthakady, N, Deprospo, B, Raj, PM et al. (2018). Integrated copper heat spreaders in glass panel embedded packages with near-zero thermal interface resistance . 2018-May 2013-2018. 10.1109/ECTC.2018.00302

cited authors

  • Nedumthakady, N; Deprospo, B; Raj, PM; Sundaram, VS; Tummala, R; Byers, K; Garrison, S; Gibson, C; Elsbury, M

abstract

  • Ultra-thin, panel embedded packages in glass and laminate substrates with embedded copper heat-spreaders with near-zero thermal interface resistance are demonstrated for the first time. This unique package addresses the thermal dissipation requirements of 30W-100W power amplifiers by embedding the IC in the glass substrate and direct metallization with large copper heat spreaders. This package also demonstrates a solution to mitigate the stresses induced from copper-glass CTE mismatch using built-in stress buffers. Ultra-low loss dry film polymers used to embed the IC and serve as the RDL dielectrics result in low loss at GHz frequency bands.

publication date

  • August 7, 2018

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

start page

  • 2013

end page

  • 2018

volume

  • 2018-May