Miniaturized and high-performance RF packages with ultra-thin glass substrates Article

Kim, Min Suk, Pulugurtha, Markondeya Raj, Kim, Youngwoo et al. (2018). Miniaturized and high-performance RF packages with ultra-thin glass substrates . MICROELECTRONICS JOURNAL, 77 66-72. 10.1016/j.mejo.2018.05.002

International Collaboration

cited authors

  • Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; Park, Gapyeol; Cho, Kyungjun; Smet, Vanessa; Sundaram, Venky; Kim, Joungho; Tummala, Rao

authors

publication date

  • July 1, 2018

published in

keywords

  • DESIGN
  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • FRONT-END MODULE
  • Front-end
  • Glass package
  • Glass substrate
  • INTERPOSERS
  • Nanoscience & Nanotechnology
  • RF
  • Science & Technology
  • Science & Technology - Other Topics
  • Technology
  • Through-package via
  • WLAN

Digital Object Identifier (DOI)

publisher

  • ELSEVIER SCI LTD

start page

  • 66

end page

  • 72

volume

  • 77