Large Low-CTE Glass Package-to-PCB Interconnections with Solder Strain-Relief Using Polymer Collars Conference

Menezes, Gary, Smet, Vanessa, Kobayashi, Makoto et al. (2014). Large Low-CTE Glass Package-to-PCB Interconnections with Solder Strain-Relief Using Polymer Collars . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1959-1964.

International Collaboration

cited authors

  • Menezes, Gary; Smet, Vanessa; Kobayashi, Makoto; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1959

end page

  • 1964