Packaging of multi-core microprocessors: Trade-offs and potential solutions Conference

Muthana, P, Swaminathan, M, Tummala, R et al. (2005). Packaging of multi-core microprocessors: Trade-offs and potential solutions . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1895-1903.

cited authors

  • Muthana, P; Swaminathan, M; Tummala, R; Sundaram, V; Wan, LX; Bhattacharya, S; Raj, PM

authors

date/time interval

  • May 31, 2005 -

publication date

  • January 1, 2005

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

International Standard Book Number (ISBN) 10

Conference

  • 55th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1895

end page

  • 1903