3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators Conference

Sun, Teng, Spurney, Robert G, Watanabe, Atom et al. (2019). 3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1300-1305. 10.1109/ECTC.2019.00201

Industry Collaboration International Collaboration

cited authors

  • Sun, Teng; Spurney, Robert G; Watanabe, Atom; Raj, P Markondeya; Sharma, Himani; Tummala, Rao; Yoshihiro, Furukawa

sustainable development goals

authors

date/time interval

  • May 29, 2019 -

publication date

  • January 1, 2019

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Magnetic composites
  • Science & Technology
  • Technology
  • integrated buck converter inductors

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 69th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1300

end page

  • 1305