3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators Conference

Sun, Teng, Spurney, Robert G, Watanabe, Atom et al. (2019). 3D Packaging with Embedded High-Power-Density Passives for Integrated Voltage Regulators . 00 1300-1305. 10.1109/ectc.2019.00201

cited authors

  • Sun, Teng; Spurney, Robert G; Watanabe, Atom; Raj, P Markondeya; Sharma, Himani; Tummala, Rao; Yoshihiro, Furukawa

authors

publication date

  • May 31, 2019

keywords

  • 40 Engineering
  • 4008 Electrical Engineering
  • 4009 Electronics, Sensors and Digital Hardware
  • 7 Affordable and Clean Energy

Digital Object Identifier (DOI)

Conference

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

publisher

  • Institute of Electrical and Electronics Engineers (IEEE)

start page

  • 1300

end page

  • 1305

volume

  • 00