Demonstration of patternable all-Cu compliant interconnections with enhanced manufacturability in chip-to-substrate applications Conference

Mohan, Kashyap, Shahane, Ninad, Sosa, Ramon et al. (2018). Demonstration of patternable all-Cu compliant interconnections with enhanced manufacturability in chip-to-substrate applications . 301-307. 10.1109/ECTC.2018.00053

Industry Collaboration

cited authors

  • Mohan, Kashyap; Shahane, Ninad; Sosa, Ramon; Raj, PM; Smet, Vanessa; Tummala, Rao; Khan, Sadia; Antoniou, Antonia

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

keywords

  • AG
  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • MONOLITHIC NANOPOROUS COPPER
  • Science & Technology
  • TEMPERATURE
  • Technology

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 301

end page

  • 307