High aspect ratio metal-polymer composite structures for nano interconnects Conference

Aggarwal, AO, Raj, PM, Tummala, RR. (2004). High aspect ratio metal-polymer composite structures for nano interconnects . 182-186. 10.1109/ISAPM.2004.1288010

Open Access

cited authors

  • Aggarwal, AO; Raj, PM; Tummala, RR

authors

date/time interval

  • March 24, 2004 -

publication date

  • January 1, 2004

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • GA, Atlanta

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 9th International Symposium on Advanced Packaging Materials

publisher

  • IEEE

start page

  • 182

end page

  • 186