Microsystems packaging from milli to microscale to nanoscale Conference

Tummala, RR, Raj, PM, Sundaram, V. (2004). Microsystems packaging from milli to microscale to nanoscale . 1-7. 10.1109/HPD.2004.1346662

cited authors

  • Tummala, RR; Raj, PM; Sundaram, V

authors

date/time interval

  • June 30, 2004 -

publication date

  • January 1, 2004

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • SYSTEM
  • Science & Technology
  • Technology

Location

  • PEOPLES R CHINA, Shanghai

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 6th IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP 04)

publisher

  • IEEE

start page

  • 1

end page

  • 7