Microsystems packaging from milli to microscale to nanoscale Conference

Tummala, RR, Raj, PM, Sundaram, V. (2004). Microsystems packaging from milli to microscale to nanoscale . 1-7.

cited authors

  • Tummala, RR; Raj, PM; Sundaram, V

authors

abstract

  • The evolution of electronics packaging from millimeter scale to nanoscale were discussed. A concept know as System-on-Package (SOP), where the package is the entire system instead of the board was presented. The advantages of SOP over siliicon on chip (SOC) and system-in-package (SIP) were analyzed. The developments being done on nanoscale research are also discussed.

publication date

  • December 1, 2004

International Standard Book Number (ISBN) 10

International Standard Book Number (ISBN) 13

start page

  • 1

end page

  • 7