Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
Article
Wang, Yiteng, Watanabe, Atom O, Ogura, Nobuo et al. (2020). Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
. JOURNAL OF ELECTRONIC MATERIALS, 49(11), 6737-6745. 10.1007/s11664-020-08399-x
Wang, Yiteng, Watanabe, Atom O, Ogura, Nobuo et al. (2020). Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
. JOURNAL OF ELECTRONIC MATERIALS, 49(11), 6737-6745. 10.1007/s11664-020-08399-x