Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration Article

Wang, Yiteng, Watanabe, Atom O, Ogura, Nobuo et al. (2020). Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration . JOURNAL OF ELECTRONIC MATERIALS, 49(11), 6737-6745. 10.1007/s11664-020-08399-x

Industry Collaboration International Collaboration

cited authors

  • Wang, Yiteng; Watanabe, Atom O; Ogura, Nobuo; Raj, Pulugurtha Markondeya; Tummala, Rao

sustainable development goals

publication date

  • September 10, 2020

published in

keywords

  • BOUNDARY SELF-DIFFUSION
  • Engineering
  • Engineering, Electrical & Electronic
  • IC Packaging
  • MECHANICAL-PROPERTIES
  • Materials Science
  • Materials Science, Multidisciplinary
  • POWDER
  • Physical Sciences
  • Physics
  • Physics, Applied
  • RESISTIVITY
  • SILVER JOINTS
  • Science & Technology
  • Technology
  • additive manufacturing
  • copper paste
  • interconnection
  • millimeter wave
  • sintering

Digital Object Identifier (DOI)

publisher

  • SPRINGER

start page

  • 6737

end page

  • 6745

volume

  • 49

issue

  • 11