Electrodeposited copper-graphite composites for low-CTE-Integrated thermal structures Conference

Dwarakanath, S, Markondeya Raj, P, Demir, K et al. (2017). Electrodeposited copper-graphite composites for low-CTE-Integrated thermal structures . 14(2), 56-62. 10.4071/imaps.435561

cited authors

  • Dwarakanath, S; Markondeya Raj, P; Demir, K; Smet, V; Sundaram, V; Tummala, R

abstract

  • Emerging high-power and high-Temperature electronic modules require thick copper structures for power supply, thermal vias, heat spreaders, and also as carriers or lead frames for high-power packages. Such structures should coexist with glass and other substrates with low coefficient of thermal expansion (CTE) to meet high-Temperature performance, dimensional stability, and superior device interconnection reliability with low stresses and warpage. The primary challenge with these packages arises from the CTE mismatch between the conductors and the substrates. Cu-graphite composites with glass-matched CTE are explored to address this challenge through analytical modeling of properties such as CTE, Young's modulus and thermal conductivity, finite-element-modeling predictions of glass warpage and stresses, process development to deposit copper-graphite composite films with high graphite loading of 64 vol. %, and warpage measurements using shadow moirĂ©. Results indicate that Cu-graphite composites can mitigate the warpage and stress issues in high-Temperature and high-power packages.

publication date

  • April 1, 2017

Digital Object Identifier (DOI)

start page

  • 56

end page

  • 62

volume

  • 14

issue

  • 2