Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Article

Park, Gapyeol, Kim, Youngwoo, Cho, Kyungjun et al. (2021). Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer . IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 63(5), 1562-1573. 10.1109/TEMC.2021.3059846

Industry Collaboration International Collaboration

cited authors

  • Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; Park, Hyunwook; Watanabe, Atom O; Raj, Pulugurtha Markondeya; Tummala, Rao R; Kim, Joungho

authors

publication date

  • October 1, 2021

published in

keywords

  • Couplings
  • Engineering
  • Engineering, Electrical & Electronic
  • Glass
  • Noise measurement
  • Polymers
  • SILICON
  • Science & Technology
  • Silicon
  • Substrates
  • Technology
  • Telecommunications
  • Transfer functions
  • interposer
  • measurement
  • noise coupling
  • noise transfer function
  • shielding structure
  • through glass via (TGV)

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 1562

end page

  • 1573

volume

  • 63

issue

  • 5