IEEE Transactions on Electromagnetic Compatibility

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IEEE Transactions on Electromagnetic Compatibility Journal

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Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer. 63:1562-1573. 2021
Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling. 59:940-951. 2017
Measurement and Analysis of Glass Interposer Power Distribution Network Resonance Effects on a High-Speed Through Glass Via Channel. 58:1747-1759. 2016
Hybrid Analysis of Electromagnetic Interference Effects on Microwave Active Circuits Within Cavity Enclosures. 52:745-748. 2010
EMI/EMC Analysis of Printed Circuit Boards Subject to Near-Zone Illuminations. 51:406-408. 2009
High-Power EMI on RF Amplifier and Digital Modulation Schemes. 50:849-860. 2008
EMI/EMC Measurements and Simulations for Cables and PCBs Enclosed Within Metallic Structures. 50:441-445. 2008
A hybrid electromagnetic-circuit method for electromagnetic interference onto mass wires. 49:893-900. 2007
A generalized MoM-SPICE iterative technique for field coupling to multiconductor transmission lines in presence of complex structures. 47:234-246. 2005
Coupling studies and shielding techniques for electromagnetic penetration through apertures on complex cavities and vehicular platforms. 45:245-257. 2003
HIRF penetration and PED coupling analysis for scaled fuselage models using a hybrid subgrid FDTD(2,2)/FDTD(2,4) method. 45:293-305. 2003
Coupling modeling and reduction techniques of cavity-backed slot antennas: FDTD versus measurements. 43:261-272. 2001
HIRF penetration through apertures: FDTD versus measurements. 43:282-294. 2001
Cosite interference between wire antennas on helicopter structures and rotor modulation effects: FDTD versus measurements. 41:221-233. 1999

International Standard Serial Number (ISSN)

0018-9375

Electronic International Standard Serial Number (EISSN)

1558-187X