Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling Article

Kim, Youngwoo, Cho, Jonghyun, Kim, Jonghoon J et al. (2017). Glass Interposer Electromagnetic Bandgap Structure for Efficient Suppression of Power/Ground Noise Coupling . IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 59(3), 940-951. 10.1109/TEMC.2016.2632703

International Collaboration

cited authors

  • Kim, Youngwoo; Cho, Jonghyun; Kim, Jonghoon J; Cho, Kyungjun; Kim, Subin; Sitaraman, Srikrishna; Sundaram, Venky; Raj, Pulugurtha Markondeya; Tummala, Rao R; Kim, Joungho

authors

publication date

  • June 1, 2017

published in

keywords

  • 3-D ICS
  • CEM
  • DESIGN
  • Electromagnetic bandgap (EBG)
  • Engineering
  • Engineering, Electrical & Electronic
  • PERFORMANCE
  • PLANES
  • SELECTIVE VALIDATION FSV
  • SIZE
  • SYSTEMS
  • Science & Technology
  • Technology
  • Telecommunications
  • glass
  • interposer
  • measurement
  • power/ground noise coupling
  • suppression
  • through glass via (TGV)

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 940

end page

  • 951

volume

  • 59

issue

  • 3