High-Temperature And Moisture-Ageing Reliability of High-Density Power Packages For Electric Vehicles Conference

Dwarakanath, Shreya, Raj, P Markondeya, Smet, Vanessa et al. (2018). High-Temperature And Moisture-Ageing Reliability of High-Density Power Packages For Electric Vehicles . 179-184. 10.1109/ECTC.2018.00035

cited authors

  • Dwarakanath, Shreya; Raj, P Markondeya; Smet, Vanessa; Sundaram, Venky; Losego, Mark D; Tummala, Rao

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

keywords

  • Adhesion
  • Electronics packaging
  • Engineering
  • Engineering, Electrical & Electronic
  • High-Power
  • High-Temperature
  • Moisture
  • Reliability
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 179

end page

  • 184