FUTURE OF EMBEDDING AND FAN-OUT TECHNOLOGIES Conference

Tummala, Rao, Sundaram, Venky, Raj, Pulugurtha M et al. (2017). FUTURE OF EMBEDDING AND FAN-OUT TECHNOLOGIES .

cited authors

  • Tummala, Rao; Sundaram, Venky; Raj, Pulugurtha M; Smet, Vanessa

authors

date/time interval

  • February 6, 2017 -

publication date

  • January 1, 2017

keywords

  • DESIGN
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • board fan-out
  • embedding RP
  • embedding digital
  • embedding fan-out
  • embedding millimeter wave
  • embedding power
  • glass fan-out
  • integrated voltage regulator
  • panel fan-out
  • wafer fan-out
  • wafer-level packaging

Location

  • HI, Kauai

Conference

  • Pan Pacific Microelectronics Symposium (Pan Pacific)

publisher

  • IEEE