Glass in electronic packaging and integration: High Q inductances for 2.35 GHz impedance matching in 0.05 mm thin glass substrates Conference

Letz, Martin, Zihan, Wu, Viswanathan, Sukhadha et al. (2018). Glass in electronic packaging and integration: High Q inductances for 2.35 GHz impedance matching in 0.05 mm thin glass substrates . 1089-1096. 10.1109/ECTC.2018.00167

Industry Collaboration International Collaboration

cited authors

  • Letz, Martin; Zihan, Wu; Viswanathan, Sukhadha; Jotz, Matthias; Maune, Holger; Jost, Matthias; Raj, P Markondeya; Sundaram, Venkatesh; Tummala, Rao

authors

date/time interval

  • May 29, 2018 -

publication date

  • January 1, 2018

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • glass package
  • glass substrate
  • high-Q
  • inductance
  • integrated passives
  • matching network

Location

  • CA, San Diego

Digital Object Identifier (DOI)

Conference

  • 68th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1089

end page

  • 1096