Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications Article

Hassan, Akeeb, Soroushiani, Sepehr, Abdal, Abdulhameed et al. (2022). Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications . IEEE OPEN JOURNAL OF NANOTECHNOLOGY, 3 52-60. 10.1109/OJNANO.2022.3163386

cited authors

  • Hassan, Akeeb; Soroushiani, Sepehr; Abdal, Abdulhameed; Sayeed, Sk Yeahia Been; Lin, Wei-Chiang; Pulugurtha, Markondeya Raj

authors

publication date

  • January 1, 2022

published in

keywords

  • CONDUCTORS
  • ELECTRONICS
  • Fan-out
  • Flexible printed circuits
  • Integrated circuit interconnections
  • Materials Science
  • Materials Science, Multidisciplinary
  • Nanoscience & Nanotechnology
  • Nanowires
  • Packaging
  • Science & Technology
  • Science & Technology - Other Topics
  • Silver
  • Stress
  • Substrates
  • THIN-FILM
  • TRANSPARENT
  • Technology
  • biophotonics
  • deformable
  • die-embedding
  • flexible
  • interconnects

Digital Object Identifier (DOI)

start page

  • 52

end page

  • 60

volume

  • 3