Florida International University
Edit Your Profile
FIU Discovery
Toggle navigation
Browse
Home
People
Organizations
Scholarly & Creative Works
Research Facilities
Support
IEEE OPEN JOURNAL OF NANOTECHNOLOGY
Journal
Overview
Identifiers
View All
Overview
publication venue for
Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications
. 3:52-60.
2022
Guest Editorial: Nanopackaging Part II
2022
Identifiers
Electronic International Standard Serial Number (EISSN)
2644-1292
