Board-Level Reliability of 3D Through Glass Via Filters During Thermal Cycling Conference

McCann, Scott, Kuramochi, Satoru, Yun, Hobie et al. (2016). Board-Level Reliability of 3D Through Glass Via Filters During Thermal Cycling . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1575-1582. 10.1109/ECTC.2016.362

Industry Collaboration International Collaboration

cited authors

  • McCann, Scott; Kuramochi, Satoru; Yun, Hobie; Sundaram, Venkatesh; Pulugurtha, M Raj; Tummala, Rao R; Sitaraman, Suresh K

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • FATIGUE LIFE PREDICTION
  • Science & Technology
  • Technology
  • glass cratering
  • integrated passive device
  • solder joint reliability
  • through glass via (TGV)

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 1575

end page

  • 1582