Process development for PWB compatible embedded capacitors
Article
Bhattacharya, SK, Markondeya Raj, P, Balaraman, D et al. (2004). Process development for PWB compatible embedded capacitors
. 30(1 Embedded Passives Technology), 31-35+4+6+8. 10.1108/03056120410496360
Bhattacharya, SK, Markondeya Raj, P, Balaraman, D et al. (2004). Process development for PWB compatible embedded capacitors
. 30(1 Embedded Passives Technology), 31-35+4+6+8. 10.1108/03056120410496360
This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM-L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (> 30nF/cm2) have been addressed through implementation of a novel low-temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi-layer system-on-package demonstration.
