Process development for PWB compatible embedded capacitors Article

Bhattacharya, SK, Markondeya Raj, P, Balaraman, D et al. (2004). Process development for PWB compatible embedded capacitors . 30(1 Embedded Passives Technology), 31-35+4+6+8. 10.1108/03056120410496360

cited authors

  • Bhattacharya, SK; Markondeya Raj, P; Balaraman, D; Windlass, H; Tummala, RR

abstract

  • This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM-L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (> 30nF/cm2) have been addressed through implementation of a novel low-temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi-layer system-on-package demonstration.

publication date

  • January 1, 2004

Digital Object Identifier (DOI)

start page

  • 31

end page

  • 35+4+6+8

volume

  • 30

issue

  • 1 Embedded Passives Technology