High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers Conference

Viswanathan, Sukhadha, Ogawa, Tomonori, Demir, Kaya et al. (2017). High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass Interposers . 1510-1516. 10.1109/ECTC.2017.292

Industry Collaboration International Collaboration

cited authors

  • Viswanathan, Sukhadha; Ogawa, Tomonori; Demir, Kaya; Huang, Timothy B; Raj, P Markondeya; Liu, Fuhan; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 30, 2017 -

publication date

  • January 1, 2017

keywords

  • 3D Interposer
  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • Science & Technology
  • Technology
  • Themal Cycle Testing (TCT)
  • Through Package Vias (TPVs)
  • Transmission lines (TLs)
  • Voltage Standing Wave Rati (VSWR)

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • IEEE 67th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 1510

end page

  • 1516