Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics Article

Shahane, Ninad, Raj, P Markondeya, Nair, Chandrasekharan et al. (2018). Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics . 12(4), 6-18. 10.1109/MNANO.2018.2869235

cited authors

  • Shahane, Ninad; Raj, P Markondeya; Nair, Chandrasekharan; Smet, Vanessa; Buch, Chintan; Tummala, Rao

authors

publication date

  • December 1, 2018

keywords

  • BINDER-FREE
  • CELL
  • EFFICIENCY
  • ENERGY-STORAGE
  • FILMS
  • GRAPHENE PAPER
  • HIGH-PERFORMANCE
  • MICRO-SUPERCAPACITORS
  • NANOGENERATORS
  • Nanoscience & Nanotechnology
  • SOLAR
  • Science & Technology
  • Science & Technology - Other Topics

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 6

end page

  • 18

volume

  • 12

issue

  • 4