IEEE Nanotechnology Magazine

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IEEE Nanotechnology Magazine Journal

publication venue for

Nanopackaging for FutureG Solutions. 18:10-20. 2024
Packaging at Nanoscale Will Advance Future Heterogeneous System Integration. 18:3-4. 2024
Nanopackaging for Component Assembly and Embedded Power in Flexible Electronics. 12:6-18. 2018
Nanomagnetics for High-Performance, Miniaturized Power, and RF Components. 6:18-23. 2012
Nanopackaging Research at Georgia Tech 3-D system miniaturization. 3:20-25. 2009
Nanopackaging Pervades Future Electronic and Bioelectronic Systems 2019
Next-Generation Nanopackaging 2018

International Standard Serial Number (ISSN)

1932-4510

Electronic International Standard Serial Number (EISSN)

1942-7808