Packaging at Nanoscale Will Advance Future Heterogeneous System Integration Article

Pulugurtha, Markondeya Raj, Bonyar, Attila. (2024). Packaging at Nanoscale Will Advance Future Heterogeneous System Integration . 18(2), 3-4. 10.1109/MNANO.2024.3358688

cited authors

  • Pulugurtha, Markondeya Raj; Bonyar, Attila

authors

publication date

  • April 1, 2024

keywords

  • Bandwidth
  • Capacitors
  • Multichip modules
  • Nanomaterials
  • Nanopackaging
  • Nanoscale devices
  • Nanoscience & Nanotechnology
  • Science & Technology
  • Science & Technology - Other Topics
  • Special issues and sections
  • Terahertz communications

Digital Object Identifier (DOI)

publisher

  • IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC

start page

  • 3

end page

  • 4

volume

  • 18

issue

  • 2