New paradigm in IC-package interconnection by reworkable nano-interconnects Conference

Aggarwal, AO, Raj, PM, Abothu, IR et al. (2004). New paradigm in IC-package interconnection by reworkable nano-interconnects . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 451-460.

cited authors

  • Aggarwal, AO; Raj, PM; Abothu, IR; Sacks, MD; Tay, AAO; Tummala, RR

authors

date/time interval

  • February 3, 2004 -

publication date

  • January 1, 2004

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

International Standard Book Number (ISBN) 10

Conference

  • 54th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 451

end page

  • 460