Novel board material technology for next-generation microelectronic packaging Conference

Kumbhat, N, Raj, PM, Hegde, S et al. (2005). Novel board material technology for next-generation microelectronic packaging . PROCESSING AND PROPERTIES OF ADVANCED CERAMICS AND COMPOSITES V, 167 371-381.

cited authors

  • Kumbhat, N; Raj, PM; Hegde, S; Pucha, RV; Sundaram, V; Hayes, S; Atmur, S; Bhattacharya, S; Sitaraman, SK; Tummala, RR

authors

date/time interval

  • April 18, 2004 -

publication date

  • January 1, 2005

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Ceramics
  • Physical Sciences
  • Physics
  • Physics, Condensed Matter
  • Science & Technology
  • Technology

Location

  • IN, Indianapolis

International Standard Book Number (ISBN) 10

Conference

  • 106th Annual Meeting of the American-Ceramic-Society

publisher

  • AMER CERAMIC SOC

start page

  • 371

end page

  • 381

volume

  • 167