Demonstration of enhanced system-level reliability of ultra-thin BGA packages with circumferential polymer collars and doped solder alloys Conference

Singh, Bhupender, Huang, Ting-Chia, Sundaram, Venky et al. (2016). Demonstration of enhanced system-level reliability of ultra-thin BGA packages with circumferential polymer collars and doped solder alloys . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1377-1385. 10.1109/ECTC.2016.351

International Collaboration

cited authors

  • Singh, Bhupender; Huang, Ting-Chia; Sundaram, Venky; Pulugurtha, Raj; Smet, Vanessa; Tummala, Rao; Kawamoto, Satomi

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

published in

keywords

  • Board-level reliability
  • DROP IMPACT RELIABILITY
  • Engineering
  • Engineering, Electrical & Electronic
  • JOINT
  • Science & Technology
  • Technology
  • doped solders
  • glass BGA packages
  • polymer collars
  • stencil printing
  • thermal cycling
  • warpage

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 1377

end page

  • 1385