Selection and evaluation of materials for future System-on-Package (SOP) substrate Other Scholarly Work

cited authors

  • Raj, PM; Shinotani, K; Seo, M; Bhattacharya, S; Sundaram, V; Zama, S; Lu, JC; Zweben, C; White, GE; Tummala, RR

authors

publication date

  • January 1, 2001

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Optics
  • Physical Sciences
  • Science & Technology
  • Technology

WoS ID

  • 000169430500198

Digital Object Identifier (DOI)

start page

  • 1193

end page

  • 1197