Selection and evaluation of materials for future System-on-Package (SOP) substrate Other Scholarly Work

Raj, PM, Shinotani, K, Seo, M et al. (2001). Selection and evaluation of materials for future System-on-Package (SOP) substrate . 1193-1197. 10.1109/ECTC.2001.927978

cited authors

  • Raj, PM; Shinotani, K; Seo, M; Bhattacharya, S; Sundaram, V; Zama, S; Lu, JC; Zweben, C; White, GE; Tummala, RR

authors

publication date

  • January 1, 2001

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Optics
  • Physical Sciences
  • Science & Technology
  • Technology

Location

  • FL, ORLANDO

Digital Object Identifier (DOI)

publisher

  • IEEE

start page

  • 1193

end page

  • 1197