Interfacial Delamanination of Mold Compound in Fan-out Packages Conference

Rambhatla, VNN Trilochan, Samet, David, Raj, P Markondeya et al. (2017). Interfacial Delamanination of Mold Compound in Fan-out Packages . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 827-833. 10.1109/ECTC.2017.323

International Collaboration

cited authors

  • Rambhatla, VNN Trilochan; Samet, David; Raj, P Markondeya; Kawamoto, Satomi; Tummala, Rao R; Sitaraman, Suresh K

authors

date/time interval

  • May 30, 2017 -

publication date

  • January 1, 2017

published in

keywords

  • COPPER-EPOXY INTERFACE
  • DELAMINATION
  • Engineering
  • Engineering, Electrical & Electronic
  • FRACTURE-TOUGHNESS
  • Science & Technology
  • Technology
  • fan-out
  • interfacial delamination
  • lead-frame
  • mode mixity
  • mold comound

Location

  • FL, Lake Buena Vista

Digital Object Identifier (DOI)

Conference

  • IEEE 67th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 827

end page

  • 833