Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer Conference

Mehrotra, Gaurav, Jha, Gopal, Goud, Janagama D et al. (2008). Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1410-+. 10.1109/ECTC.2008.4550162

Industry Collaboration

cited authors

  • Mehrotra, Gaurav; Jha, Gopal; Goud, Janagama D; Raj, P Markondeya; Venkatesan, Mali; Iyer, Mahadevan; Hess, Dennis

authors

date/time interval

  • January 1, 2008 -

publication date

  • January 1, 2008

published in

keywords

  • 3-DIMENSIONAL INTEGRATION
  • COPPER
  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • PACKAGE
  • QUALITY
  • SIZE
  • Science & Technology
  • TECHNOLOGY
  • Technology

Location

  • FL, Orlando

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 13

Conference

  • 58th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1410

end page

  • +