Mehrotra, G, Jha, G, Goud, JD
et al. (2008). Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer
.
1410-1416. 10.1109/ECTC.2008.4550162
Mehrotra, G, Jha, G, Goud, JD et al. (2008). Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer
. 1410-1416. 10.1109/ECTC.2008.4550162