Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on MCM-L compatible substrates Conference

Raj, PM, Windlass, H, Shinotani, K et al. (2000). Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on MCM-L compatible substrates . 1681-1685. 10.1109/ECTC.2000.853445

cited authors

  • Raj, PM; Windlass, H; Shinotani, K; Bhattacharya, SK; Sundaram, V; Tummala, RR

authors

date/time interval

  • May 21, 2000 -

publication date

  • January 1, 2000

keywords

  • COPPER
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, LAS VEGAS

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 50th Electronic Components & Technology Conference (ECTC 01)

publisher

  • IEEE

start page

  • 1681

end page

  • 1685