Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates Article

Ramachandran, Koushik, Liu, Fuhan, Raj, P Markondeya et al. (2013). Conductive Anodic Filament Failures in Fine-Pitch Through-Via Interconnections in Organic Package Substrates . JOURNAL OF ELECTRONIC MATERIALS, 42(2), 348-354. 10.1007/s11664-012-2274-4

cited authors

  • Ramachandran, Koushik; Liu, Fuhan; Raj, P Markondeya; Sundaram, Venky; Tummala, Rao

authors

publication date

  • February 1, 2013

published in

keywords

  • ABSORPTION
  • CIRCUIT
  • Conductive anodic filament
  • Engineering
  • Engineering, Electrical & Electronic
  • Materials Science
  • Materials Science, Multidisciplinary
  • Physical Sciences
  • Physics
  • Physics, Applied
  • Science & Technology
  • Technology
  • electrochemical migration
  • fine-pitch through-vias
  • organic package substrates

Digital Object Identifier (DOI)

publisher

  • SPRINGER

start page

  • 348

end page

  • 354

volume

  • 42

issue

  • 2