Ramachandran, K, Liu, F, Raj, PM
et al. (2013). Conductive anodic filament failures in fine-pitch through-via interconnections in organic package substrates
.
JOURNAL OF ELECTRONIC MATERIALS, 42(2), 348-354. 10.1007/s11664-012-2274-4
Ramachandran, K, Liu, F, Raj, PM et al. (2013). Conductive anodic filament failures in fine-pitch through-via interconnections in organic package substrates
. JOURNAL OF ELECTRONIC MATERIALS, 42(2), 348-354. 10.1007/s11664-012-2274-4