Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates Conference

Ali, Muhammad, Watanabe, Atom, Kakutani, Takenori et al. (2020). Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1376-1382. 10.1109/ECTC32862.2020.00218

International Collaboration

cited authors

  • Ali, Muhammad; Watanabe, Atom; Kakutani, Takenori; Raj, Pulugurtha M; Tummala, Rao R; Swaminathan, Madhavan

authors

date/time interval

  • June 3, 2020 -

publication date

  • January 1, 2020

published in

keywords

  • 5G and mm-wave
  • BANDPASS-FILTERS
  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology
  • bandpass filter
  • diplexer
  • heterogeneous integration
  • microstrip
  • semi-additive process

Location

  • ELECTR NETWORK

Digital Object Identifier (DOI)

Conference

  • 70th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 1376

end page

  • 1382