Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages Article

Sayeed, Sk Yeahia Been, Wilding, Daniel, Camara, Jose Solis et al. (2019). Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages . 2019(1), 000163-000168. 10.4071/2380-4505-2019.1.000163

cited authors

  • Sayeed, Sk Yeahia Been; Wilding, Daniel; Camara, Jose Solis; Vital, Dieff; Bhardwaj, Shubhendu; Raj, PM

publication date

  • October 1, 2019

keywords

  • 40 Engineering
  • 4009 Electronics, Sensors and Digital Hardware
  • 4016 Materials Engineering

Digital Object Identifier (DOI)

publisher

  • IMAPS - International Microelectronics Assembly and Packaging Society

start page

  • 000163

end page

  • 000168

volume

  • 2019

issue

  • 1