Aggarwal, AO, Raj, PM, Sundaram, V
et al. (2005). 50 micron pitch wafer level packaging testbed with reworkable IC-package nano interconnects
.
2 1139-1146.
Aggarwal, AO, Raj, PM, Sundaram, V et al. (2005). 50 micron pitch wafer level packaging testbed with reworkable IC-package nano interconnects
. 2 1139-1146.