50 micron pitch wafer level packaging testbed with reworkable IC-package nano interconnects Conference

Aggarwal, AO, Raj, PM, Sundaram, V et al. (2005). 50 micron pitch wafer level packaging testbed with reworkable IC-package nano interconnects . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 1139-1146.

cited authors

  • Aggarwal, AO; Raj, PM; Sundaram, V; Ravi, D; Koh, S; Mullapudi, R; Tummala, RR

authors

date/time interval

  • May 31, 2005 -

publication date

  • January 1, 2005

published in

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

International Standard Book Number (ISBN) 10

Conference

  • 55th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1139

end page

  • 1146