Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages
Conference
Kim, MS, Pulugurtha, MR, Wu, Z et al. (2016). Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages
. 2016-August 2384-2388. 10.1109/ECTC.2016.287
Kim, MS, Pulugurtha, MR, Wu, Z et al. (2016). Innovative Electrical Thermal Co-Design of Ultra-High Q TPV-Based 3D Inductors in Glass Packages
. 2016-August 2384-2388. 10.1109/ECTC.2016.287
This paper introduces an innovative concept of electrical-Thermal co-design for high-Q 3D inductors using through-package-via (TPV)-based copper networks in ultra-Thin power amplifier-integrated glass modules. The copper networks are designed to provide high quality factor inductors, and also simultaneously enable heat transfer in ultra-miniaturized glass packages. Such TPV-based 3D inductors achieved the highest Q factor (>150 @ 1 GHz, >200 @ 2.4 GHz, SRF > 25 GHz), 7 times greater than that of the state-of-The-Art package embedded inductors at LTE frequencies. The thermal structure, with power amplifier die assembled onto it, also reduces the package size by placing the embedded TPV-based inductor adjacent to it without affecting its Q.
