Innovative Electrical Thermal Co-design of Ultra-high Q TPV-based 3D Inductors in Glass Packages Conference

Kim, Min Suk, Pulugurtha, Markondeya Raj, Wu, Zihan et al. (2016). Innovative Electrical Thermal Co-design of Ultra-high Q TPV-based 3D Inductors in Glass Packages . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2384-2388. 10.1109/ECTC.2016.287

cited authors

  • Kim, Min Suk; Pulugurtha, Markondeya Raj; Wu, Zihan; Sundaram, Venky; Tummala, Rao

authors

date/time interval

  • May 31, 2016 -

publication date

  • January 1, 2016

published in

keywords

  • 3D Inductor
  • Engineering
  • Engineering, Electrical & Electronic
  • Glass Packages
  • Heat-transfer
  • Science & Technology
  • Technology
  • Through-package-via

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 66th IEEE Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE COMPUTER SOC

start page

  • 2384

end page

  • 2388