Evaluation of low stress dielectrics for board application Conference

Brownlee, K, Shinotani, KI, Raj, PM et al. (2003). Evaluation of low stress dielectrics for board application . 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 136-141. 10.1109/ECTC.2003.1216268

cited authors

  • Brownlee, K; Shinotani, KI; Raj, PM; Bhattacharya, SK; Wong, CP; Tummala, RR

authors

date/time interval

  • May 27, 2003 -

publication date

  • January 1, 2003

published in

keywords

  • Computer Science
  • Computer Science, Information Systems
  • Engineering
  • Engineering, Electrical & Electronic
  • Optics
  • Physical Sciences
  • Science & Technology
  • Technology

Location

  • LA, NEW ORLEANS

Digital Object Identifier (DOI)

Conference

  • 53rd Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 136

end page

  • 141