The role of packaging in changing from traditional interconnections of discrete components to thin film component integration. The system-on-package is a system concept with this package integration, in contrast to SiP, a modular concept. The SoP, a system centric technology, is based on embedded thin film components in organic boards or packages. An immediate application of SoP with RF/digital/opto-integration is a miniaturized, single package that can support computing, wireless, and consumer functions.
