Choudhury, A, Kumbhat, N, Raj, PM
et al. (2010). Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology
.
350-356. 10.1109/ECTC.2010.5490950
Choudhury, A, Kumbhat, N, Raj, PM et al. (2010). Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology
. 350-356. 10.1109/ECTC.2010.5490950