Low Temperature, Low Profile, Ultra-Fine Pitch Copper-To-Copper Chip-Last Embedded-Active Interconnection Technology Conference

Choudhury, Abhishek, Kumbhat, Nitesh, Raj, P Markondeya et al. (2010). Low Temperature, Low Profile, Ultra-Fine Pitch Copper-To-Copper Chip-Last Embedded-Active Interconnection Technology . 350-356. 10.1109/ECTC.2010.5490950

Industry Collaboration

cited authors

  • Choudhury, Abhishek; Kumbhat, Nitesh; Raj, P Markondeya; Zhang, Rongwei; Sundaram, Venky; Dunne, Rajiv; Bolanos-Avila, Mario; Wong, CP; Tummala, Rao

authors

date/time interval

  • June 1, 2010 -

publication date

  • January 1, 2010

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • NV, Las Vegas

Digital Object Identifier (DOI)

Conference

  • 60th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 350

end page

  • 356