Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections Conference

Mohan, Kashyap, Shahane, Ninad, Raj, Pulugurtha Markondeya et al. (2017). Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections . THIRTY-THIRD ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2018), 3083-3090.

cited authors

  • Mohan, Kashyap; Shahane, Ninad; Raj, Pulugurtha Markondeya; Antoniou, Antonia; Smet, Vanessa; Tummala, Rao

authors

date/time interval

  • March 26, 2017 -

publication date

  • January 1, 2017

published in

keywords

  • AG
  • CU
  • ELECTRONICS
  • Energy & Fuels
  • Engineering
  • Engineering, Electrical & Electronic
  • FABRICATION
  • METALS
  • Nanoporous Cu
  • Science & Technology
  • Technology
  • densification
  • die-attach interconnection
  • film sintering
  • power electronics

start page

  • 3083

end page

  • 3090