Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration
Conference
Sundaram, V, Tummala, R, Wiedenman, B et al. (2006). Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration
. 2006 1375-1380. 10.1109/ECTC.2006.1645836
Sundaram, V, Tummala, R, Wiedenman, B et al. (2006). Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration
. 2006 1375-1380. 10.1109/ECTC.2006.1645836