Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration Conference

Sundaram, Venky, Tummala, Rao, Wiedenman, Boyd et al. (2006). Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration . 1375-+. 10.1109/ECTC.2006.1645836

International Collaboration

cited authors

  • Sundaram, Venky; Tummala, Rao; Wiedenman, Boyd; Liu, Fuhan; Raj, P Markondeya; Abothu, Isaac Robin; Bhattacharya, Swapan; Varadarajan, Mahesh; Bongio, Ed; Sherwood, Walt

authors

date/time interval

  • January 1, 2006 -

publication date

  • January 1, 2006

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Engineering, Manufacturing
  • Materials Science
  • Materials Science, Multidisciplinary
  • Science & Technology
  • Technology

Location

  • CA, San Diego

Digital Object Identifier (DOI)

International Standard Book Number (ISBN) 10

Conference

  • 56th Electronic Components and Technology Conference

publisher

  • IEEE

start page

  • 1375

end page

  • +