Coaxial Through-Package-Vias (TPVs) for Enhancing Power Integrity in 3D Double-side Glass Interposers Conference

Kumar, Gokul, Raj, P Markondeya, Cho, Jounghyun et al. (2014). Coaxial Through-Package-Vias (TPVs) for Enhancing Power Integrity in 3D Double-side Glass Interposers . 541-547.

International Collaboration

cited authors

  • Kumar, Gokul; Raj, P Markondeya; Cho, Jounghyun; Gandhi, Saumya; Chakraborti, Parthasarathi; Sundaram, Venky; Kim, Joungho; Tummala, Rao

authors

date/time interval

  • May 27, 2014 -

publication date

  • January 1, 2014

keywords

  • Engineering
  • Engineering, Electrical & Electronic
  • Science & Technology
  • Technology

Location

  • FL, Lake Buena Vista

Conference

  • IEEE 64th Electronic Components and Technology Conference (ECTC)

publisher

  • IEEE

start page

  • 541

end page

  • 547