InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

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InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM Journal

publication venue for

A NEW TILE MODEL FOR AIR FLOW DISTRIBUTION IN A FULL-FEATURED DATA CENTER WITH RAISED FLOOR PLENUM 2021
A Comprehensive CFD Study of Tile Flow Rate Distribution in a Compact Data Center Laboratory 2020
Conjugate Heat Transfer Analysis of the Supercritical CO₂ Based Counter Flow Compact 3D Heat Exchangers 2020
Performance Evaluation of Liquid 3D Chip Cooling Systems under Non-uniform Power Density: Effects of Inlet and Plenum Configurations 2019

International Standard Serial Number (ISSN)

1936-3958